View IC14A-PLR-SF-EJR_6803848.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

a2 single slot smt connectors for card-bus based pc cards ic14 series pc card standard compliant board space-saving secure board retention three-stage pop-up card ejection mechanism two anchoring pins when the eject button is mistakenly pressed without a pc card inserted protruding button is vulnerable to damage. existing products ic14 four metal fittings equipment outline smt unit smt unit guide unit features 1. space-saving design facilitates pattern routing responding to the need for the equipment miniaturization, the board mounting area has been further reduced by relocation of the mounting screws away from the possible routing of the conductive traces. 2. card insertion shock protection total of 6 board retention points assures that there is no transfer of card insertion forces to the solder terminations. 3. new ?op-up?button card ejection mechanism the button does not protrude without the card being inserted, preventing it? damage when carrying the notebook computer. 4. customized ejection buttons the configuration, color or length can be designed for customer? specific applications. 5. reliable and balanced card ejection mechanism hirose? unique ejection mechanism will apply force equally at each edge of the inserted card. in addition, large distance of the ejection allows easy hold on the card. applications notebook pcs, audio/video equipment and other devices utilizing pc cards. board mounting standoff eject button standard reverse 1.5mm 2.2mm 2.2mm left right left right right right left left pop-up folding rigid pop-up pop-up pop-up pop-up folding rigid pop-up pop-up folding rigid pop-up
a3 500 v dc 500 v ac / one minute 1ma dc frequency: 10 to 2000 hz, single amplitude of 1.52 mm or acceleration of 147m/s2 (peak), 4 hours / 3 axis 96 hours at temperature of 40 ? 2 ? and humidity of 90% to 95% temperature: -55? / +5? to +35? / +85? / +5? to +35? duration: 30 / + 5 max. / 30 / + 5 max. (minutes) 5 cycles 10000 cycles at 400 to 600 cycles per hour reflow: at the recommended temperature profile manual soldering: 300 ? for 3 seconds 1000 m ? min. no flashover or insulation breakdown. 60 m ? max. (initial value) no electrical discontinuity of 100 ns or more. insulation resistance: 100 m ? min. insulation resistance: 100 m ? min. contact resistance: 20m ? max. from initial value no deformation of any component. no affect on contacts. 1. insulation resistance 2. withstanding voltage 3. contact resistance 4. vibration 5. humidity 6. temperature cycle 7. durability (mating/unmating) 8. resistance to soldering heat ratings 0.5a 125v ac operating temperature range operating humidity range current rating voltage rating -55? to +85? (note 1 ) relative humidity 95% max. (no condensation) storage temperature range storage humidity range -40 ? to +70 ? (note 2) 40% to 70% (note 2) product specifications item specifications conditions note 1: includes temperature rise caused by current flow. note 2: the term ?torage?refers to products stored for long period of time prior to mounting and use. operating temperature r ange and humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. materials/finish component insulator contacts ground/eject metal fittings positioning pin material finish remarks heat resistant thermoplastic compound brass stainless brass color: black contact area: gold plated termination area: tin-lead plated (note) ---------- tin-lead plated (note) ul94v-0 ---------- ---------- ---------- smt unit guide unit component insulator cover/eject metal fittings spring material finish remarks pbt stainless steel color: black ---------- ---------- ul94v-0 ---------- ---------- note: lead-free specified connectors are tin plated.
a4 ordering information smt unit guide unit series name : ic14 standoff type blank : 0 mm a : 2.2 mm b : 1.5 mm board mounting type pl: standard type plr: reverse type sf : smt unit eject button position ejr : right-side eject ejl : left-side eject number of ground contacts product specification code blank : tin-lead plated (71): lead-free plated 1 2 3 4 5 6 series name : ic14 standoff type blank : 0 mm a : 2.2 mm b : 1.5 mm (note 1) g: guide unite eject button type blank : rigid button p : pop-up button f : folding button eject button position ejr: right-side eject ejl: left-side eject 7 1 7 2 8 5 8 9 ic14 a - plr - sf - ejr -(71) 1 2 3 6 4 5 ic14 a - g - p ejr 7 8 9 10 10 11 11 11 note 1: in the ic14b type, the screw attachment holes in the guide unit are not threaded. note 2: in this series the smt unit and the guide unit must be used in combinations shown below. note 2: other combinations cannot be used. * series name ( ? ) * standoffs ( ? ) * ejection button position ( ? )
a5 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot. right pop-up button ic14, ic14a ic14b prbm3 sbr 3 smt unit( 1 ) 3 3 84.55 ( ejector button pushed-in for withdrawal ) 85.8 (card fully inserted) ( 7.4 ) eject metal components movable range sar pra guide unit ( 2 ) #2-m2(2x) 61.8 58.9 3.3 6 63.5 32.6 74.5 62.55 27.45 57.4 32max no.34 no.68 gnd 5.5max 7.5max gnd button position for card ejection gnd no.1 gnd no.35 no.2 no.36 30.55 no.1 no.2 no.36 no.35 no.34 no.68 c 4.8 3.5 b a 2.5 22.8 62.6 43.8 2.5 5 5 stand off height 2.2mm 1.5mm cl640-1301-0 cl640-1303-6 cl640-1309-2 ic14-pl-sf-ejr ic14a-pl-sf-ejr ic14b-pl-sf-ejr cl640-1409-7 cl640-1411-9 cl640-1413-4 ic14-g-pejr ic14a-g-pejr ic14b-g-pejr 2.7 4.9 4.2 5.5 7.7 7 0.3 2.5 1.8 13.1 13.5 13.3 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number standard
a6 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot. left pop-up button ic14, ic14a ic14b smt unit( 1 ) guide unit ( 2 ) 3 b 5.5max 7.5max 32max gnd 57.4 gnd gnd gnd eject metal components movable range c 6 sal p l a no.35 no.36 no.2 no.1 no.34 no.68 no.1 no.35 no.2 no.36 no.34 no.68 85.8 ( card fully inserted ) ( 7.4 ) 84.55 ( ejector button pushed-in for withdrawal ) 32.6 4.8 61.8 58.9 62.55 30.55 3.3 27.45 74.5 a 63.5 3.5 3 3 62.6 5 2.5 22.8 43.8 2.5 sbl plbm9 #2-m2(2x) button position for card ejection stand off height 2.2mm 1.5mm cl640-1302-3 cl640-1304-9 cl640-1310-1 ic14-pl-sf-ejl ic14a-pl-sf-ejl ic14b-pl-sf-ejl cl640-1410-6 cl640-1412-1 cl640-1414-7 ic14-g-pejl ic14a-g-pejl ic14b-g-pejl 2.7 4.9 4.2 5.5 7.7 7 0.3 2.5 1.8 13.1 13.5 13.3 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number standard
a7 right pop-up button smt unit( 1 ) a b no.35 4.8 3.5 no.1 no.2 no.36 no.34 no.68 63.5 32.6 61.8 58.9 84.55( ejector button pushed-in for withdrawal ) 85.8 30.55 gnd 5.5max 7.5max c 32max no.1 gnd no.35 no.2 no.36 gnd no.34 no.68 6 57.4 gnd 74.5 62.55 27.45 3.3 guide unit ( 2 ) (card fully inserted) eject metal components movable range ( 7.4) p r a r a 3 3 3 button position for card ejection stand off height 2.2mm cl640-1307-7 IC14A-PLR-SF-EJR cl640-1411-9 ic14a-g-pejr 4.9 7.7 2.3 14.3 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number reverse 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot.
a8 left pop-up button type 32 eject metal components movable range (card fully inserted) (7.4) guide unit ( 2 ) smt unit( 1 ) 5.5max 7.5max max no.1 gnd gnd no.35 no.2 no.36 gnd gnd no.34 no.68 57.4 85.8 84.55( ejector button pushed-in for withdrawal ) 32.6 61.8 58.9 62.55 30.55 3.3 27.45 74.5 63.5 c no.1 no.2 no.34 no.35 no.36 no.68 b 4.8 a 3.5 6 3 3 3 l a p l a button position for card ejection stand off height 2.2mm cl640-1308-0 ic14a-plr-sf-ejl cl640-1412-1 ic14a-g-pejl 4.9 7.7 2.3 14.3 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number reverse 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot.
a9 left folding button c 3 sal 5.5max 7.5max 32max gnd 57.4 gnd gnd no.1 no.35 no.2 no.36 no.34 no.68 eject metal components movable range 4.8 l a 6 ( 93.6 ) card fully inserted:85.6 42.05 61.8 58.9 62.55 3.3 27.45 (65.45) 5 8 34.55 ejector pushed-in for withdrawal: ( 9.5 ) 74.5 3 3 b no.35 no.36 no.2 no.1 no.34 no.68 a gnd button position for card ejection guide unit ( 2 ) smt unit( 1 ) stand off height 2.2mm cl640-1302-3 cl640-1304-9 ic14-pl-sf-ejl ic14a-pl-sf-ejl cl640-1406-9 cl640-1408-4 ic14-g-fejl ic14a-g-fejl 2.7 4.9 5.5 7.7 0.3 2.5 13.9 14.1 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number standard 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot.
a10 left folding button smt unit( 1 ) guide unit ( 2 ) no.1 no.2 no.34 no.35 no.36 no.68 l a l a 5.5max 7.5max 32 max no.1 57.4 gnd no.35 no.2 no.36 gnd gnd no.68 eject metal components movable range 6 ( 93.6 ) card fully inserted:85.6 42.05 61.8 58.9 62.55 3.3 27.45 (65.45 ) 5 8 34.55 ejector pushed-in for withdrawal: ( 9.5 ) 4.8 74.5 a b c 3 3 3 gnd no.34 button position for card ejection stand off height 2.2mm cl640-1308-0 ic14a-plr-sf-ejl cl640-1408-4 ic14a-g-fejl 4.9 7.7 2.3 14.9 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number reverse 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot.
a11 left rigid button 3 8 57.4 c 6 85.6 ( card fully inserted ) 4.8 3.5 a b 32.6 61.8 58.9 62.55 3.3 27.45 74.5 63.5 3 3 l a sal no.34 no.68 no.36 no.35 no.2 no.1 gnd 7.5max 5.5max eject metal components movable range gnd 32max no.36 no.2 no.35 no.1 gnd no.34 no.68 gnd smt unit( 1 ) guide unit ( 2 ) stand off height 2.2mm cl640-1302-3 cl640-1304-9 ic14-pl-sf-ejl ic14a-pl-sf-ejl cl640-1402-8 cl640-1404-3 ic14-g-ejl ic14a-g-ejl 2.7 4.9 5.5 7.7 0.3 2.5 13.4 13.7 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number standard 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot.
a12 left rigid button smt unit( 1 ) guide unit ( 2 ) 3 8 no.1 no.2 no.35 no.36 no.68 fl l a 57.4 l a 5.5max 7.5max 32max no.1 gnd gnd no.35 no.2 no.36 gnd gnd no.34 no.68 c 6 eject metal components movable range 85.6 ( card fully inserted ) c 4.8 3.5 a b 32.6 61.8 58.9 62.55 3.3 27.45 74.5 63.5 3 3 no.34 reverse stand off height 2.2mm cl640-1308-0 ic14a-plr-sf-ejl cl640-1404-3 ic14a-g-ejl 4.9 7.7 2.3 14.4 smt unit 1 cl no. part number guide unit 2 a (mm) b (mm) c (mm) weight (g) cl no. part number 1 : all illustrations show the smt unit ( 1 ) and guide unit ( 2 ) assemblied. 2 : dimensions for card insertion are in accordance with pc card standard. 3 : indicated dimensions are symmetrical to the center of the card insertion slot.
a13 b pcb mounting pattern standard without standoff (left button) standoff 1.5mm (left button) standoff 2.2mm (common to both right & left buttons) standoff 1.5mm (right button) without standoff (right button) 4.250.05 52.2max 55.2min 54.650.05 53.9min 52.2max no conductive traces 59.1max 32.5min 14.4max 2-?2.2 2-?2.2 +0.1 +0 2.95min no conductive traces 5.65min c 4.3min 12.2250.05 3.550.1 4.0250.05 54.4250.05 2.50.1 gnd gnd mounting area 58.90.05 1.95 min (2.2) 64.750.05 card edge position shield plate mounting area 50.40.05 2 2-?2.2 2-?2.2 +0.1 +0 1.8max 3.5min 54.650.05 4.8min 1.8max card edge position no conductive traces 14.4max 32.5min 59.1max 4.250.05 2.95min no conductive traces 5.65min c 4.3min 12.2250.05 3.550.1 4.0250.05 54.4250.05 2.50.1 gnd gnd mounting area 58.90.05 1.95min (2.2) 64.750.05 shield plate mounting area 50.40.05 2 59.2min 53.2max 12.2250.05 3.550.1 4.0250.05 54.4250.05 2.50.1 gnd gnd mounting area no conductive traces 4.20.05 480.05 (2.2) 64.80.05 card edge position 50.40.05 3.5min 4.4max 3.5 min 4.4max 56.9min no conductive traces c 43.80.05 shield plate mounting area 210.05 2 50.40.05 3.8 min no conductive traces 7.75 min 7min 2.6max 2.6max 2 2 3.5 min 11.5max 14.6min 3.5min 3.5 min 3.8 min 7.75 min 7min 2.6max 2.6 max 56.9min 2 2 59.2min 53.2max 12.2250.05 3.550.1 4.0250.05 54.4250.05 gnd no conductive traces 43.80.05 2.40.05 46.20.05 (2.2) 64.80.05 card edge position 22.80.05 2 no conductive traces 4.4max no conductive traces 3.5 min c 2.50.1 gnd mounting area 11.5max 14.6min shield plate mounting area 3.5min 3.5min 4.4max 2-?2.2 +0.1 +0 2-?2.2 +0.1 +0 note 1) area show the conductive pattern prohibited area. note.2 ) indicated dimensions are symmerical to the center of the card insertion slot. 2.95min no conductive traces card edge position no conductive traces 7.25min 3.75min 1.5max 1.5max 5.65min c 4.3min 2-?2.2 +0.1 0 59.2min 53.2max 12.2250.05 3.550.1 4.0250.05 54.4250.05 2.50.1 gnd gnd mounting area 11.5max 14.6min 58.90.05 1.95min 4.05min 4.250.05 54.650.05 (2.2) 64.750.05 shield plate mounting area 50.40.05 2 2 2 2
a14 reverse standoff 2.2mm (common to both right & left buttons) reverse standoff 2.2mm standard without standoff b pcb mounting area (enlarged views) c ?1.850.05 (plated through hole) ?1.80.05 (plated through hole) 4.40.1 ?2.3 ?2.35 30.1 20.1 ( terminal mounting area ) 4.20.1 ( terminal mounting area ) 4.40.1 no.34 no.35 1.90.1 30.1 gnd no.1 no.68 gnd 2.20.05 3.92750.05 46.47250.05 48.20.05 68-0.370.03 p=0.6350.03 no.2 c 2 1.05min 2.7min 4.2min 58.4min 1.05min no conductive traces ?1.80.05 ( plated through hole ) 4.40.1 ?1.850.05 ( plated through hole ) ?2.3 ?2 .35 30.1 20.1 ( terminal mounting area ) 4.20.1 ( terminal mounting area ) 4.40.1 no.35 no.2 no.34 1.90.1 30.1 gnd no.68 no.1 gnd 2.20.05 3.92750.05 46.47250.05 48.20.05 68-0.370.03 p=0.6350.03 standoff 1.5mm, 2.2mm c 1.05min 2.7min 4.2min 58.4min 1.05min no conductive traces ?1.80.05 ( plated through hole ) 4.40.1 ?1.850.05 ( plated through hole ) ?2.3 ? 2.35 30.1 20.1 ( terminal mounting area ) 4.20.1 ( terminal mounting area ) 4.40.1 no.35 no.2 no.34 1.90.1 30.1 gnd no.68 no.1 gnd 2.20.05 3.92750.05 46.47250.05 48.20.05 68-0.370.03 p=0.6350.03 2 no conductive traces 7.25min 3.75min 1.5max 1.5max 5.65min c 4.3min 2-?2.2 +0.1 0 59.2min 53.2max 12.2250.05 3.550.1 4.0250.05 54.4250.05 2.50.1 gnd gnd mounting area 11.5max 14.6min no conductive traces 58.90.05 1.95min 4.05min 4.250.05 54.650.05 (2.2) 64.750.05 card edge position shield plate mounting area 50.40.05 2 2 2 note 1) area show the conductive pattern prohibited area. note.2 ) indicated dimensions are symmerical to the center of the card insertion slot. 2
a15 b assembly of units and board placement procedures (1) mount the smt unit on the pcb board. fig. 1 fig. 2 note 1: verify and make sure that the position of the stroke arm of the smt unit and the push rod of the guide unit are at the positions indicated in fig. 1. (as delivered). if needed, position them as shown. correct position of the push rod and the stroke arm is required for correct assembly of both units. note 2: make sure that the smt unit is positioned securely. note 3: soldering will not be possible with the guide unit attached first. the guide unit must be attached and secured to the pcb board after the smt unit is attached to the pcb. smt unit guide unit stroke arm push rod pcb prbm3 pbr par sbr a interference interference sbr sbr
a16 fig. 3 fig. 3-1 (2) align both arrow marks (stamped on the shield plate) on the guide unit with the corresponding grooves on the (mounted on th e board) smt unit (as illustrated of fig. 3 and 3-1). pbr prbm3 par sbr a fig. 3-1 fig. 3-2 insulator part shield plate position a position b sbr a groove gide unit arrow mark smt unit pcb fig. 3-2
a17 fig. 4 note 3: place the guide unit over the installed smt unit, (exercising caution not to touch the spring, push rod or the stroke a rm).ref. fig.4 pbr par prbm3 guide unit holding areas
a18 fig. 5 fully locked (3) slide the guide unit forward until it is locked with the smt unit. fully locked units should be as shown on fig. 5. pbr slide forward spring portion slide forward prbm3 sbr par guide unit holding areas smt unit shiel plate locking area visible insulator no space sbr
a19 fig. 6 note 5: it is assumed that the guide unit and the smt unit will be mounted on the same pcb. however, in some applications the gu ide unit may be mounted directly on the devices case/housing. it is critical that the miss-alignment of the guide unit must be kept within 0.15 mm. the side clearance between the case/housing and the shield plate should be 0.15mm minimum. ref. fig. 6 note 6: do not insert/eject the pc card before the smt unit and the guide unit are fully mounted and locked, with the push rod and stroke arm connected. pbr prbm3 sbr par device case/housing note 5. clearance between body and shield: 0.15 mm minimum. 0.15 0.15
a20 note 7: the ic14 and ic14a assemblies do not require separate hex nuts. note 8: hex nuts and screws are required for the ic14b assemblies. max. length of the screw thread is 1.4mm. fig. 8 fig. 7 (4) the guide unit should be securely attached with two screws. par (4-1) ic14 and ic14a types ??? fig. 7 (from the bottom of the pcb) pbr par (4-2) ic14b type ??? fig. 8 (from the top of the pcb) screw size connector type recommended tightening torque (n?m) m20.4 ic14 type ic14a and ic14b type 0.12~0.16 0.14~0.18
a21 b recommended procedure for removal of the guide unit (1) remove the 2 screws attaching the guide unit to the pcb. (2) make sure that the stroke arm of the smt unit and the pushrod of the guide unit are at the positions indicated in fig. 1. fig. 1 fig. 2 (3) as illustrated in fig. 2, the lock between the shield plate and the ribs of the insulated case can be released. press the insulator on both side of the installed assembly and carefully slide the guide unit. prbm3 sbr par pcb stroke arm push rode remove screws pbr guide unit smt unit release pressure points (each side) range of retaining position press press release pressure points (each side) pull guide unit in this direction left side right side detail a pull guide unit in this direction shield plate prbm3 sbr par pbr
a22 fig. 4 note 2: assure that the push rod remains in its original position. moving it from this position may cause it to fall-out. do not move in this position original push rod position prbm3 sbr fig. 3 detail a - enlarged view note 1: as illustrated in the enlarged view of fig. 3, the lock is released by deflecting the insulator approximately 0.5 mm. insulator (deflect) shield plate detail a lock release condition
a23 b recommended opening dimensions for the device housing (card insertion slot and ejection button guide) (55) (28.5) (33.2) (6) 1 1 1 : pc card center line dimensions b handling precautions (1) metal components of these connector assemblies have sharp edges. use caution when handling, installing or dis-assembling. (2) the design of the devices case/housing should incorporate sufficient guide and support for the ejection button. (3) slight tool marks or cleaning liquid residue the surfaces of the guide unit will not affect form, fit or function of the as semblies.
a24 b recommended temperature profile temperature (?) 220? 60s(max) 60~120s 250?(peak) start 25? 150? 170? time (seconds) soldering preheating 0 50 100 150 200 250 recommended conditions reflow system : ir reflow solder composition : paste, 63%sn/37%pb (flux content 9wt%) test board : glass epoxy 80mm125mm1.6mm thick metal mask : 0.15mm thick recommended conditions reflow system : ir reflow solder composition : paste, 96.5%sn/3.0%ag/0.5%cu (flux content 10.5wt%) test board : glass epoxy 80mm125mm1.6mm thick metal mask : 0.15mm thick the temperature profiles are based on the above conditions. in individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. consult your solder paste and equipment manufacturer for specific recommendations. using typical solder paste using lead-free solder paste temperature (?) time (seconds) start preheating soldering 60~90s 20~30s 30s 5s max

▲Up To Search▲

Price & Availability of IC14A-PLR-SF-EJR

	To Download IC14A-PLR-SF-EJR Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .